Core Technology
High Power Semiconductor Laser Chip SMD Technology
Beam shaping, beam quality optimization technology
Spatial beam combining of multiple optical paths and high-precision fiber coupling technology
Semiconductor Laser Packaging Technology
实验项目 | 参考标准 | 实验条件 |
快速冷热冲击 | GR-468-CORE | -40°C~85°C，>10K/min，高低温各保持10min，循环 100 次 |
高温贮存 | GR-468-CORE | 85℃，168hrs |
低温贮存 | GR-468-CORE | -40℃，72hrs |
高温高湿贮存 | GR-468-CORE | 85℃，85% RH，168hrs |
实验项目 | 参考标准 | 实验条件 |
机械冲击 | MIL-STD-883 Method 2022 | 200g，2.5ms 5次/轴 |
| 机械振动 | MIL-STD-883 Method 2022 | 20g，20-2000-20Hz，4min/循环4次/轴 |
实验项目 | 参考标准 | 实验条件 |
连续老化 | NA | 33A，50℃壳温2000hrs（针对采用35W芯片的产品） 33A，55℃壳温2000hrs（针对采用35W芯片的产品） |
| 脉冲老化 | NA | 38A，50%占空比，10kHz，40℃壳温，1000hrs |
Military standard reliability test
The high-power fiber-coupled semiconductor lasers produced by Xinghan Laser have passed the military-standard reliability test to ensure the mechanical properties and environmental endurance of the products.
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Focus on Fiber Laser Pump
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